GLOBALFOUNDRIES and ARM join hands to develop 28nm chips
At the 2010 Mobile World Congress, GLOBALFOUNDRIES and ARM announced their combine plan to develop next-generation chips using 28nm fabrication process technology. Both of them revealed new details on their leading-edge System-on-Chip (SoC) platform technology for powering the next generation of wireless products and applications. The new chip manufacturing platform is projected to enable a 40 percent increase in computing performance, a 30 percent decrease in power consumption, and a 100 percent increase in standby battery life.
The new platform includes collaboration on two GLOBALFOUNDRIES process variants: 28nm super low power (SLP) for mobile and consumer applications and 28nm high performance (HP) for applications requiring maximum performance.
The platform is based on the ARM Cortex-A9 processor, optimized ARM physical IP and GLOBALFOUNDRIES’ 28nm Gate-First High-K Metal Gate (HKMG) process.
Together, ARM and GLOBALFOUNDRIES will enable manufacturers of embedded devices such as smartphones, smartbooks, tablets and more to address increasing design and manufacturing complexities while reducing time to volume production at mature yields.
GLOBALFOUNDRIES expects to start production on these next-generation technologies in 2H 2010 at Fab 1 in Dresden, Germany.
