Samsung today announced that it has started shipping the world’s first and smallest high-density memory modules based on 2Gb, 50nm-class DDR3. Samsung is shipping 18 configurations of its high-density, high-performance DDR3-based modules, which are designed for servers. They include a 16GB RIMM and an 8GB RDIMM. The 16GB high density module operates at 1066Mbps, which allows 192GB of total memory density for a 2-socket CPU server system. Samsung also is the first to offer 16GB RDIMMs operating at 1.35 volts, providing around 20 percent savings in power consumption over 1.5V DDR3 solutions.

In addition, the 16GB RDIMM features a dual-die package configuration, which is more efficient in cost and performance over the widely discussed quad-die configuration.

The 2Gb DDR3 consumes at least 40 percent less power than 1Gb configurations, supporting strong industry demand for lower power consumption, which is particularly important with server systems, as well as the new generation of notebooks.