VIA EPIA-T700 — the world’s first Mobile-ITX module
VIA today announced its first product based on the recently announced Mobile-ITX form factor. Measuring a mere 6cm x 6cm, the VIA EPIA-T700 is a uniquely compact computer-on-module that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications. Designed to deliver a simple modular approach to device design that precipitates greater miniaturization and portability, the Mobile-ITX-based VIA EPIA-T700 makes it easier than ever before to design and manufacture compact devices. With customized carrier boards connected using ultra low profile 3mm connectors, the VIA EPIA-T700 is in a class of its own.
The VIA EPIA-T700 is powered by a specially miniaturized 1GHz VIA Eden ULV processor and the compact VIA VX820 MSP that together offer industry-leading I/O flexibility in the most compact of available form factors. Further, the VIA EPIA-T700 features 512MB of DDR2 on-board system memory.
The VIA VX820 media system processor adds a wealth of key features including the VIA Chrome9 DX9 integrated graphics core, the VIA Chromotion video engine with hardware acceleration of MPEG-2, MPEG-4, WMV9, and VC1 video formats, and VIA Vinyl HD Audio supporting up to eight channels of HD audio.
