Cray and Intel today signed a multi-year agreement to advance high-performance computing (HPC) on Intel microprocessors while delivering broad new Intel and Cray technologies in future Cray server systems. The collaboration of these two industry leaders will result in HPC systems that will help solve some of the world's most complex scientific, engineering and humanitarian challenges. Both of them plan to explore future supercomputer component designs such as multi-core processing and advanced interconnects.

"This collaboration provides the HPC market segment with access to the best microprocessors the industry has to offer at any point in time, in the most advanced supercomputers in the world," said Peter Ungaro, president and CEO of Cray. "This further strengthens Cray's industry-leading adaptive supercomputing vision as we move into the Cascade timeframe and beyond."

"Cray's commitment to Intel is a testament of our commitment to HPC and the strength of our hardware and software roadmap and many-core research," said Patrick Gelsinger, senior vice president and general manager of Intel's Digital Enterprise Group. "Throughout Cray's history, it has been an innovator in high-end HPC while Intel has pushed the boundaries of processor technology.