• IBM & Alliance announces 28nm low-power technology

  • ibm_logo2.jpg
    Today IBM & Alliance including Chartered Semiconductor, GLOBALFOUNDRIES, Infineon, Samsung, and STMicroelectronics announced a new 28nm high-k metal gate, low-power bulk complementary metal oxide semiconductor (CMOS) process technology. The low-power, 28nm technology platform can provide power-performance and time-to-market advantages for producers of a broad range of power-sensitive mobile and consumer electronics applications, including the fast-growing mobile Internet device market segment.


    The best thing about this development is that the new 28nm chip can provide a 40 percent performance improvement and a more than 20 percent reduction in power — all in a chip that is half the size — compared with 45nm technology.

    Related Posts Plugin for WordPress, Blogger...
    Posted in Topics : Industry Buzz; Tags : on April 17, 2009

    Related Links

    • Keep current with all things PC...

    • Follow

  • This article is similar to..

    1. IBM-Led Chip Alliance Delivers Major Semiconductor Performance Leap, Power Savings Using Innovative “High-K/Metal Gate” Material
    2. AMD To Supply Processors To Founder Technology In China
    3. Samsung 40nm DRAM chip expected to save 30 percent power
  • Archives

  • Popular